Approvals Description Gained Certificate No.
Quality System Dec 2003 M1002
Generic PCB Specification Sept 2002 E082/CA
BS 123300
Multilayer    
BS 123200
Plated Through Hole    
BS 123100
Single & Double Sided Non PTH    
CECC 23000
European PCB Capability Approval    
Environmental Management System Nov 2001 EMS 61464
Component - Wiring, Printed April 2004 E111052(M)
National Recognised Standard March 1997 20734

Manufacturing Limits
Maximum Number of Layers = 24
Minimum Plated Through Hole = 0.2 mm
Minimum Mechanical Blind = 0.2 mm (1:1 ratio)
Minimum Laser Blind Via = 1:1 ratio
Minimum Track & Gap = 0.1 mm
Max Circuit Size Plated Through = 579.12 x 426.72 mm
Max Circuit Size Multilayer
= 574.04 x 421.64 mm

Metallic Coatings
Hot Air Solder Level
Immersion Silver (AlphaStar)
Electroless Nickel & Gold
Electrolytic Nickel & Gold
Electrolytic Silver

Organic Coatings
Photoimageable Solder Resist (Variety of colours available)
Peelable Solder Mask (Various types available)
Component Silkscreen Identification (Variety of colours available)
Carbon Ink (Used for switch contacts)

Special Products/Services
Polyimide High Temperature Multilayer PCB's
Manufacturing PTFE Materials
Bonded Heat Sinks
Sub-Contract Immersion Silver Service
Controlled Impedance
Flex / Flex Rigid


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